Properties and Applications: This resin has a large planar naphthalene ring structure. After curing, it can form a stacked structure, which improves heat resistance, reduces water absorption, lowers the CTE after curing, and improves the modulus of the product, etc. It can be used in electronic packaging, aerospace composites, electronic ink and other high-end fields. Packaging and Transportation: Packed in 1Kg, 10Kg, 25Kg or 220Kg metal barrels. This product is not flammable, so it can be stored and transported according to general chemicals. It should be stored in dry and ventilated place. The quality guarantee period is 1 year. If the product has crystal solidification, it can be heated at 80℃ to melt thoroughly before use.