Product
Tetramethylbiphenyl epoxy resin

Tetramethylbiphenyl epoxy resin

氯含量 ppm:
粘度 25℃:
Tg:

华南负责人:魏经理 18891555602 蔡经理 18049652996

华东负责人:曹经理 18189242081

西南 西北:徐经理 15091761603

外贸负责人:朱经理 13122525601

产品详情

Chemical CompositionPolymer of 3,3 ', 5,5' - tetramethyl-4,4 '- hydroquinone and (chloromethyl) epoxyethane

【Performance and Application】 The product has low viscosity, low chlorine content, excellent heat and chemical resistance, and the cured resin exhibits good heat resistance and chemical stability. The product can be used in fields such as electronic packaging, copper-clad laminates, inks, etc.

【technical indicators】

Tetramethylhydroquinone epoxyEpoxy equivalent(g/eq)melting point(℃)viscosity(mPa.s/150℃)Easily hydrolyzed chlorine(ppm)Total chlorine(ppm)
ZLE-4000H178-188
105-115
5-20
<200<800
ZLE-4000U<100<300


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